AMD's SP7 platform may facilitate CPUs with an astounding 1,400 watts of maximum power consumption, with tested chillers ensuring effective temperature management.

In the world of technology, AMD is gearing up for a significant leap with their Zen 6-based processors, codenamed Venice. These processors, boasting up to 256 cores, could potentially consume up to 1,400W (1.4 kW) of power, a substantial increase from the current range-topping EPYC 9965 with 192 Zen 5 cores, which has a TDP of 500W but a peak power consumption of around 700W.

To tackle this power challenge, AMD and several other companies are developing advanced cooling systems. The system includes a cold plate mounted on the processor, a pump, a reservoir, a plate heat exchanger, and a chiller set to 17°C. This cooling system, designed for AMD's SP7 processors, ensures that the coolant flow remains unobstructed even under maximum load, indicating that it is viable for long-term use.

EKWB and Auras are among the companies currently developing cooling plates for SP7 processors, capable of handling a maximum thermal load of around 350 watts. Meanwhile, Taiwan Microloops Corp. is preparing standard coolant distribution units (CDUs) with refrigeration capacities ranging from 60 kW to 800 kW, suitable for full-rack or multi-rack liquid cooling deployments.

TMC is also developing a dual-loop water cooling system capable of handling thermal loads of around 1,400W for SP7 CPUs. This system absorbs heat at the cold plate and transfers it through a primary loop to the heat exchanger, where it is offloaded to a secondary loop connected to the chiller.

While liquid cooling offers an effective solution for managing the high power consumption of AMD's future CPUs, it has a long road ahead before immersion cooling becomes a viable option several years down the road.

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