KIOXIA Unveils UFS Variation 4.1 Embedded Memory Devices for Automotive Use
KIOXIA America, Inc., the U.S.-based subsidiary of KIOXIA Corporation, a leading worldwide supplier of flash memory and solid-state drives (SSDs), has announced the sampling of new Universal Flash Storage (UFS) Ver. 4.1 embedded memory devices. These new devices are designed specifically for automotive applications, aiming to meet the rigorous demands of next-generation in-vehicle systems.
The new UFS 4.1 devices integrate KIOXIA's innovative BiCS FLASH 3D flash memory and a controller in a JEDEC-standard package. KIOXIA's 8th generation BiCS FLASH 3D flash memory introduces CBA (CMOS directly Bonded to Array) technology. This technology is expected to deliver improved performance, reliability, and power efficiency.
The new UFS 4.1 devices have been engineered to deliver impressive performance improvements compared to KIOXIA's previous UFS 3.1 generation. They offer approximately 2.1 times sequential read performance, 2.5 times sequential write performance, 2.1 times random read performance, and 3.7 times random write performance.
In addition to the performance enhancements, the new UFS 4.1 devices are compliant with the UFS 4.1 Specification, which includes WriteBooster related extensions such as WriteBooster Buffer Resizing and Pinned Partial Flush Mode. These extensions aim to further improve write performance and power efficiency.
The new UFS 4.1 devices also boast enhanced diagnostic capabilities, including a newly added vendor-specific device health descriptor. This feature is designed to provide more detailed information about the device's health and status, helping to ensure reliable operation in automotive environments.
The new UFS 4.1 devices are available in capacities of 128 gigabytes (GB), 256 GB, 512 GB, and 1 terabyte (TB). Sample shipments of the 1TB UFS 4.1 device began in June, while the 128 GB and 256 GB devices began in July.
These new UFS 4.1 devices are designed to support full duplexing, which enables concurrent reading and writing between the host processor and UFS device. They also meet AEC-Q100/104 Grade 2 standards, supporting case temperature up to 115°C.
The new UFS 4.1 devices mark a significant step forward in the development of high-performance, reliable, and power-efficient embedded memory solutions for automotive applications. KIOXIA America and Western Digital are the developers of these new devices.
As the automotive industry continues to evolve, the need for high-performance, reliable, and power-efficient storage solutions becomes increasingly important. The new UFS 4.1 devices from KIOXIA America are well-positioned to meet these demands, offering impressive performance improvements and enhanced diagnostic capabilities.
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