Teledyne FLIR's OEM Division Announces the Launch of Boson+ IQ Thermal Imaging Development Kit at DSEI UK in 2025

Teledyne FLIR OEM Unveils Boson+ IQ Development Kit at DSEI UK 2025

Teledyne FLIR OEM, a subsidiary of Teledyne Technologies Incorporated, has made a significant stride in the field of edge AI capabilities with the launch of the Boson+ IQ Development Kit. The kit, which will be showcased at the Teledyne FLIR stand (#S3-110) during DSEI UK at ExCeL London from September 9-12, promises to revolutionise the defence, security, and industrial sectors.

At the heart of the Boson+ IQ Development Kit is the Teledyne FLIR OEM AVP, powered by the Qualcomm Dragonwing QCS8550 system-on-chip (SoC). This high-performance component delivers an industry-leading 50 trillion operations per second (TOPS) with a typical power draw of just 2.5 watts.

The multicore architecture of the Teledyne FLIR OEM AVP supports Prism AI object detection models and Prism ISP features, including denoising and super resolution for exceptional image clarity in challenging environments. These features make the kit particularly useful for autonomy applications such as aerial drones, loitering munitions, and ground-based robotics.

The Boson+ IQ Development Kit is a comprehensive solution for integrators, combining reference hardware with Prism software. It comes with the Boson+ and Prism SDKs, hardware interface control documentation (ICD), and expert engineering support. The kit also includes interface and carrier boards with three MIPI interfaces, enabling developers to integrate visible or other sensor types into their systems.

Software-enabled features like Prism SKR and Prism Supervisor can add powerful capabilities to mission-critical applications in defence, security, and industrial automation. Prism SKR facilitates autonomous target detection and terminal guidance, while Prism Supervisor offers autonomous operation to designated way points via GPS or visual-based navigation (VBN) location technology.

Jared Faraudo, vice president of product management and programs at Teledyne FLIR OEM, stated that the kit enables faster development cycles, industry-best image quality, and longer mission endurance with minimal power consumption. The Boson+ IQ Development Kit is future-ready, with compatibility for upcoming additions, including Prism SKR and Prism Supervisor.

The Boson+ IQ Development Kit is applicable across defence, security, and industrial platforms, making it a versatile tool for various applications. DSEI UK, one of the world's premier defence and security exhibitions, is the perfect platform for Teledyne FLIR OEM to showcase this innovative solution.

In conclusion, the Boson+ IQ Development Kit is a significant leap forward in the development of edge AI capabilities with advanced thermal sensors for defence, security, and industrial platforms. Visit Teledyne FLIR OEM at stand #S3-110 during DSEI UK 2025 to explore the possibilities of this cutting-edge technology.